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Philips Semiconductors
Product specification
PowerMOS transistor
PHP3N50
GENERAL DESCRIPTION
N-channel enhancement mode field-effect power transistor in a plastic envelope featuring high avalanche energy capability, stable off-state characteristics, fast switching and high thermal cycling performance with low thermal resistance. Intended for use in Switched Mode Power Supplies (SMPS), motor control circuits and general purpose switching applications.
QUICK REFERENCE DATA
SYMBOL VDS ID Ptot RDS(ON) PARAMETER Drain-source voltage Drain current (DC) Total power dissipation Drain-source on-state resistance MAX. 500 3.4 83 3 UNIT V A W
PINNING - TO220AB
PIN 1 2 3 tab gate drain source drain DESCRIPTION
PIN CONFIGURATION
tab
SYMBOL
d
g
1 23
s
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134) SYMBOL PARAMETER ID IDM PD PD/Tmb VGS EAS IAS Tj, Tstg Continuous drain current Pulsed drain current Total dissipation Linear derating factor Gate-source voltage Single pulse avalanche energy Peak avalanche current Operating junction and storage temperature range CONDITIONS Tmb = 25 C; VGS = 10 V Tmb = 100 C; VGS = 10 V Tmb = 25 C Tmb = 25 C Tmb > 25 C VDD 50 V; starting Tj = 25C; RGS = 50 ; VGS = 10 V VDD 50 V; starting Tj = 25C; RGS = 50 ; VGS = 10 V MIN. - 55 MAX. 3.4 2.2 14 83 0.67 30 210 2.5 150 UNIT A A A W W/K V mJ A C
THERMAL RESISTANCES
SYMBOL Rth j-mb Rth j-a PARAMETER Thermal resistance junction to mounting base Thermal resistance junction to ambient CONDITIONS MIN. TYP. 60 MAX. 1.5 UNIT K/W K/W
February 1997
1
Rev 1.000
Philips Semiconductors
Product specification
PowerMOS transistor
PHP3N50
ELECTRICAL CHARACTERISTICS
Tj = 25 C unless otherwise specified SYMBOL V(BR)DSS V(BR)DSS / Tj RDS(ON) VGS(TO) gfs IDSS IGSS Qg(tot) Qgs Qgd td(on) tr td(off) tf Ld Ld Ls Ciss Coss Crss PARAMETER Drain-source breakdown voltage Drain-source breakdown voltage temperature coefficient Drain-source on resistance Gate threshold voltage Forward transconductance Drain-source leakage current Gate-source leakage current Total gate charge Gate-source charge Gate-drain (Miller) charge Turn-on delay time Turn-on rise time Turn-off delay time Turn-off fall time Internal drain inductance Internal drain inductance Internal source inductance Input capacitance Output capacitance Feedback capacitance CONDITIONS VGS = 0 V; ID = 0.25 mA VDS = VGS; ID = 0.25 mA VGS = 10 V; ID = 1.5 A VDS = VGS; ID = 0.25 mA VDS = 30 V; ID = 1.5 A VDS = 500 V; VGS = 0 V VDS = 400 V; VGS = 0 V; Tj = 125 C VGS = 30 V; VDS = 0 V ID = 2.1 A; VDD = 400 V; VGS = 10 V MIN. 500 2.0 1 TYP. 0.6 2.5 3.0 2 1 30 10 26 2 13 10 29 66 32 3.5 4.5 7.5 310 50 28 MAX. 3 4.0 25 250 200 30 3 17 UNIT V V/K V S A A nA nC nC nC ns ns ns ns nH nH nH pF pF pF
VDD = 250 V; ID = 2.1 A; RG = 18 ; RD = 100
Measured from contact screw on tab to centre of die Measured from drain lead 6 mm from package to centre of die Measured from source lead 6 mm from package to source bond pad VGS = 0 V; VDS = 25 V; f = 1 MHz
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
Tj = 25 C unless otherwise specified SYMBOL IS ISM VSD trr Qrr PARAMETER Continuous source current (body diode) Pulsed source current (body diode) Diode forward voltage Reverse recovery time Reverse recovery charge CONDITIONS Tmb = 25C Tmb = 25C IS = 2.5 A; VGS = 0 V IS = 2.1 A; VGS = 0 V; dI/dt = 100 A/s MIN. TYP. 370 2.7 MAX. 3.4 14 1.2 UNIT A A V ns C
February 1997
2
Rev 1.000
Philips Semiconductors
Product specification
PowerMOS transistor
PHP3N50
120 110 100 90 80 70 60 50 40 30 20 10 0
PD%
Normalised Power Derating
10
Zth j-mb / (K/W)
PHP2N60
D= 1 0.5 0.2 0.1 0.1 0.05 0.02 0 0.01 P D tp D= tp T t 1E+01
T 1E-05 1E-03 t/s 1E-01
0
20
40
60
80 100 Tmb / C
120
140
Fig.1. Normalised power dissipation. PD% = 100PD/PD 25 C = f(Tmb)
ID% Normalised Current Derating
Fig.4. Transient thermal impedance. Zth j-mb = f(t); parameter D = tp/T
ID, Drain current (Amps) Tj = 25 C 7 6 5 5.5 V 4 3 2 1 5V VGS = 4.5 V 7V 10 V 6V PHP3N50
120 110 100 90 80 70 60 50 40 30 20 10 0
8
0
20
40
60
80 Tmb / C
100
120
140
0
0
5
10 15 20 VDS, Drain-Source voltage (Volts)
25
30
Fig.2. Normalised continuous drain current. ID% = 100ID/ID 25 C = f(Tmb); conditions: VGS 10 V
Fig.5. Typical output characteristics. ID = f(VDS); parameter VGS
PHP3N50 10 V
100
ID, Drain current (Amps)
PHP3N50
6 5
RDS(on), Drain-Source on resistance (Ohms) 4.5 V 5V 5.5 V VGS = 6 V 7V Tj = 25 C
10
RD
O S(
N)
=
V
/ DS
ID
4
tp = 10 us
3
100 us 1 DC 1 ms 10 ms 100 ms 10000
2 1 0
0.1 10
100 1000 VDS, Drain-source voltage (Volts)
0
1
2
3 4 5 ID, Drain current (Amps)
6
7
8
Fig.3. Safe operating area. Tmb = 25 C ID & IDM = f(VDS); IDM single pulse; parameter tp
Fig.6. Typical on-state resistance. RDS(ON) = f(ID); parameter VGS
February 1997
3
Rev 1.000
Philips Semiconductors
Product specification
PowerMOS transistor
PHP3N50
8 7 6
ID, Drain current (Amps) VDS = 30 V
PHP3N50 Tj = 25 C
4
VGS(TO) / V max.
3
typ.
5 4 3 2 1 0
0 1
Tj = 150 C
2
min.
0
2 4 6 VGS, Gate-Source voltage (Volts)
8
10
-60
-40
-20
0
20
40 60 Tj / C
80
100
120
140
Fig.7. Typical transfer characteristics. ID = f(VGS); parameter Tj
gfs, Transconductance (S) VDS = 30 V PHP3N50
Fig.10. Gate threshold voltage. VGS(TO) = f(Tj); conditions: ID = 0.25 mA; VDS = VGS
ID / A SUB-THRESHOLD CONDUCTION
3 2.5 2 1.5 1
1E-01
1E-02
1E-03
2%
typ
98 %
150 C
Tj = 25 C
1E-04
1E-05
0.5 0
1E-06
0
1
2
3 4 5 ID, Drain current (A)
6
7
8
0
1
2 VGS / V
3
4
Fig.8. Typical transconductance. gfs = f(ID); parameter Tj
a Normalised RDS(ON) = f(Tj)
Fig.11. Sub-threshold drain current. ID = f(VGS); conditions: Tj = 25 C; VDS = VGS
PHP3N50 Ciss
1000
Junction capacitances (pF)
2
100
Coss
1
10 Crss
0 -60 -40 -20 0 20 40 60 Tj / C 80 100 120 140
1
1
10 100 VDS, Drain-Source voltage (Volts)
1000
Fig.9. Normalised drain-source on-state resistance. a = RDS(ON)/RDS(ON)25 C = f(Tj); ID = 1.5 A; VGS = 10 V
Fig.12. Typical capacitances, Ciss, Coss, Crss. C = f(VDS); conditions: VGS = 0 V; f = 1 MHz
February 1997
4
Rev 1.000
Philips Semiconductors
Product specification
PowerMOS transistor
PHP3N50
15
VGS, Gate-Source voltage (Volts) ID = 2.1 A Tj = 25 C 240 V 100 V
PHP3N50
20
IF, Source-Drain diode current (Amps) VGS = 0 V
PHP3N50
VDD = 400 V
15
10
10 150 C
5
Tj = 25 C
5
0
0
10
20 Qg, Gate charge (nC)
30
40
0
0
0.5 1 VSDS, Source-Drain voltage (Volts)
1.5
Fig.13. Typical turn-on gate-charge characteristics. VGS = f(QG); parameter VDS
Fig.16. Source-Drain diode characteristic. IF = f(VSDS); parameter Tj
EAS, Normalised unclamped inductive energy (%)
1000
Switching times (ns) VDD = 250 V VGS = 10 V RD = 100 Ohms ID = 2.1 A Tj = 25 C td(off) tf tr
PHP3N50
120 110 100 90 80 70 60 50 40 30 20 10
100
10
td(on)
1
0
10
20 30 40 RG, Gate resistance (Ohms)
50
60
0 20 40 60 80 100 Starting Tj ( C) 120 140
Fig.14. Typical switching times. td(on), tr, td(off), tf = f(RG)
Normalised Drain-source breakdown voltage
V(BR)DSS @ Tj V(BR)DSS @ 25 C
Fig.17. Normalised unclamped inductive energy. EAS% = f(Tj)
1.15 1.1 1.05 1 0.95 0.9
+
L VDS VGS 0 RGS T.U.T. R 01 shunt
VDD
-ID/100
0.85 -100
-50
0 50 Tj, Junction temperature (C)
100
150
Fig.15. Normalised drain-source breakdown voltage. V(BR)DSS/V(BR)DSS 25 C = f(Tj)
Fig.18. Unclamped inductive test circuit. 2 EAS = 0.5 LID V(BR)DSS /(V(BR)DSS - VDD )
February 1997
5
Rev 1.000
Philips Semiconductors
Product specification
PowerMOS transistor
PHP3N50
MECHANICAL DATA
Dimensions in mm Net Mass: 2 g
4,5 max 10,3 max
1,3
3,7 2,8
5,9 min
15,8 max
3,0 max not tinned
3,0
13,5 min
1,3 max 1 2 3 (2x)
2,54 2,54
0,9 max (3x)
0,6 2,4
Fig.19. TO220AB; pin 2 connected to mounting base.
Notes 1. Observe the general handling precautions for electrostatic-discharge sensitive devices (ESDs) to prevent damage to MOS gate oxide. 2. Refer to mounting instructions for TO220 envelopes. 3. Epoxy meets UL94 V0 at 1/8".
February 1997
6
Rev 1.000
Philips Semiconductors
Product specification
PowerMOS transistor
PHP3N50
DEFINITIONS
Data sheet status Objective specification Product specification Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. (c) Philips Electronics N.V. 1997 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. This data sheet contains target or goal specifications for product development. This data sheet contains final product specifications. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
February 1997
7
Rev 1.000

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